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Platform Testing Services
Intel® Platform Testing Services - Thermal Cycle testing
Can your system handle rigorous temperature differentials?
This test service allows customers to send in a fully configured system to undergo thermal cycling. Thermal Cycling is the most common method of testing Solder Joint Reliability. The system will steadily transition from hot to cold extremes at a temperature rate typically around 10°C /minute, but not to exceed a transition rate of >20°C/minute. Testing can be performed from -40°C to 100°C. Hold times at the high and low temperature set points are configurable.
A Good System has a balance between Thermal and Acoustic Performance
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