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Processor Thermal Test Vehicle (TTV)
The CPU Thermal Test Vehicles are thermal tools that insert into the CPU socket (or soldered down in the case of an SoC) and are used to simulate the thermal characteristics of a CPU. Used for processor cooling solution development (e.g. heat sink) and for evaluating the platform thermal design. They are powered via the pads located on top surface of the test vehicle substrate; an external power supply connects to the leads soldered to the pads. May also be powered through the CPU socket pins.
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