Please turn off compatibility mode to ensure this site displays properly. For instructions to complete this action, please click here.
请关闭兼容模式,以确保网站显示正常。完成此操作的说明,请单击此处

  Home > Intel Platforms > Data Center Comms and Storage >

Processor Thermal Test Vehicle (TTV)
Processor Thermal Test Vehicle TTV
 

Product Code: STLGRN29
 

Description
 
The CPU Thermal Test Vehicles are thermal tools that insert into the CPU socket (or soldered down in the case of an SoC) and are used to simulate the thermal characteristics of a CPU. Used for processor cooling solution development (e.g. heat sink) and for evaluating the platform thermal design. They are powered via the pads located on top surface of the test vehicle substrate; an external power supply connects to the leads soldered to the pads. May also be powered through the CPU socket pins.

Login For More Information


(Your shopping cart is empty)